Signal via positioning in a multi-layer circuit board
US9916410B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2015 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Jun 22, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/394
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
One aspect is a method that includes identifying a substantially uniform distribution of signal vias for a multi-layer circuit board based on a design file defining a layout that includes via groups in a two-to-one signal-to-ground via ratio configuration. A signal via pitch is determined as a center-to-center distance between a neighboring pair of signal vias. The signal via pitch is compared to a target minimum drilling distance. A ground via is identified proximate the neighboring pair of the signal vias. Based determining that the signal via pitch of the neighboring pair is less than the target minimum drilling distance, at least one of the signal vias is positioned closer to the ground via such that after the positioning, the signal via pitch of the neighboring pair meets or exceeds the target minimum drilling distance. The design file is modified to include the positioning of the signal vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.