Detection of defects embedded in noise for inspection in semiconductor manufacturing
US9916653B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2012 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Apr 24, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
One embodiment relates to an apparatus for detecting defects on a manufactured substrate. The apparatus includes an imaging tool arranged to obtain image frames from the manufactured substrate. The apparatus further includes a data processing system which includes computer-readable code configured to compute features for pixels in an image frame and divide the pixels in the image frame into feature-defined groups of pixels. The computer-readable code is further configured to select a feature-defined group, and generate a multi-dimensional feature distribution for the selected feature-defined group. Another embodiment relates to a method of detecting defects from a test images frame and multiple reference image frames. Other embodiments, aspects, and features are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.