Package with bi-layered dielectric structure

US9917044B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Zheng Zhou · San Jose, US
• Mihir K. Roy · Chandler, US
• Chong Zhang · Chandler, US
• Kyu Oh Lee · Chandler, US
• Amanda E. Schuckman · Scottsdale, US

Key dates

• Filing date: May 13, 2015
• Grant date: Mar 13, 2018
• Expiry date: May 13, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Some embodiments of the present disclosure describe a multi-layer package with a bi-layered dielectric structure and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a dielectric structure coupled with a metal layer, with the dielectric structure including a first dielectric layer and a second dielectric layer, wherein the first dielectric layer has a thickness less than a thickness of the second dielectric layer and a dielectric loss tangent greater than a dielectric loss tangent of the second layer. Other embodiments may be described and/or claimed.