Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
US9918384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2014 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.