Polishing apparatus, polishing pad positioning method, and polishing pad
US9919403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2014 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Jul 1, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide member 130 is inserted into a guide hole 109 with an attachment surface of a polishing pad 108 downward, the polishing pad 108 is positioned on and attached to a polishing table 110. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so as to match the upper surface of the polishing table 110 with the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad 108, the portion where the release paper is peeled off is attached to the polishing table 110.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.