Peeling device, peeling system and peeling method
US9919509B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 16, 2011 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Dec 15, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1972
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.