MEMS devices including MEMS dies and connectors thereto
US9919914B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2016 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | May 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.