Patent · US Active

Laser reseal including an additional layer and alloy formation

US9919919B2 · kind B2 · utility

1Cited by

0References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jens Frey · Echterdingen, DE
Jochen Reinmuth · Reutlingen, DE
Mawuli Ametowobla · Stuttgart, DE
Philip Kappe · Stuttgart, DE

Key dates

Filing date	Nov 21, 2016
Grant date	Mar 20, 2018
Priority date	—
Expiry date	Nov 21, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/019
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a cavity, a pressure prevailing and gas mixture having a chemical composition being enclosed in the cavity. An access opening connecting the to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or chemical composition are/is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer is deposited on or grown on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.