Patent · US Active

Method, apparatus and system for modular on-die coherent interconnect for packetized communication

US9921989B2 · kind B2 · utility

3Cited by

2References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Krishnakumar Ganapathy · Bee Cave, US
Yen-Cheng Liu · Portland, US
Antonio Juan · Barcelona, ES
Steven R. Page · Hillsboro, US
Jeffrey D. Chamberlain · Tracy, US
Pau CABRE · Reus, ES
Bahaa Fahim · San Jose, US
Gunnar Gaubatz · Worcester, US

Key dates

Filing date	May 8, 2015
Grant date	Mar 20, 2018
Priority date	—
Expiry date	Mar 10, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG06F15/7825
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

In an embodiment, an apparatus comprises: a first component to perform coherent operations; and a coherent fabric logic coupled to the first component via a first component interface. The coherent fabric logic may be configured to perform full coherent fabric functionality for coherent communications between the first component and a second component coupled to the coherent fabric logic. The first component may include a packetization logic to communicate packets with the coherent fabric logic, but not include coherent interconnect interface logic to perform coherent fabric functionality. Other embodiments are described and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.