Substrate liquid processing apparatus having nozzle with multiple flow paths and substrate liquid processing method thereof
US9922849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2015 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Nov 14, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate liquid processing apparatus. The substrate liquid processing apparatus includes a processing unit, a nozzle, a silylation liquid supply mechanism, and a blocking fluid supply mechanism. The processing unit performs a water repellency imparting processing on a substrate by supplying a silylation liquid to the substrate. The nozzle includes an ejection port configured to supply the silylation liquid to the substrate positioned in the processing unit, and a silylation liquid flow path in which the silylation liquid flows toward the ejection port. The silylation liquid supply mechanism supplies the silylation liquid to the silylation liquid flow path in the nozzle through a silylation liquid supply line. The blocking fluid supply mechanism supplies a blocking fluid that blocks the silylation liquid within the silylation liquid flow path in the nozzle from an atmosphere outside the ejection port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.