Patent · US Active

System and methods for processing a substrate

US9926627B2 · kind B2 · utility

0Cited by

0References

9Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Uwe Hermanns · Seligenstadt, DE
Neil MORRISON · Seeheim-Jugenheim, DE
Tobias Stolley · Oberursel, DE
Volker Hacker · Schongau, DE

Key dates

Filing date	Dec 21, 2011
Grant date	Mar 27, 2018
Priority date	—
Expiry date	Sep 8, 2033

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/545
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

According to the present disclosure, a substrate processing apparatus for processing a flexible substrate including a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein, a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber, and a discharging assembly configured to generate a flow of charged particles to discharge the flexible substrate is provided. The discharging assembly is configured to generate an electric field for ionizing a processing gas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.