Electric circuit on flexible substrate
US9930793B2 · kind B2 · utility
0Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2014 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Sep 23, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Generally discussed herein are systems and apparatuses that can include a flexible substrate with a hermetic seal formed thereon. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a hermetic seal on a flexible substrate can include (1) forming an interconnect on a flexible substrate, (2) situating a device on the substrate near the interconnect, or (3) selectively depositing a first hermetic material on the device or interconnect so as to hermetically seal the device within the combination of the interconnect and first hermetic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.