Bonding structure and method of fabricating the same
US9931813B2 · kind B2 · utility
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5References
18Claims
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Key dates
| Filing date | May 6, 2010 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Aug 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.