Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer
US9934989B1 · kind B1 · utility
3Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Sep 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.