Method of manufacturing a cooler for semiconductor modules

US9934990B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Inpil Yoo · Unterhaching, DE
• Andreas Grassmann · Villach, AT

Key dates

• Filing date: Jan 31, 2017
• Grant date: Apr 3, 2018
• Expiry date: Jan 31, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/3107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A cooling apparatus is manufactured by: receiving a discrete module by a first singular part, the discrete module including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound; attaching a second singular part to a periphery of the first part to form a housing, the housing surrounding a periphery of the discrete module, the second part having a cutout which exposes the first cooling plate and a sealing structure facing a side of the discrete module with the first cooling plate; and filling the sealing structure with a sealing material which forms a water-tight seal around the periphery of the discrete module at the side of the discrete module with the first cooling plate.