Patent · US Active

Semiconductor package, smart card and method for producing a semiconductor package

US9935042B2 · kind B2 · utility

0Cited by

3References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Spoettl · Mintraching, DE
Frank Pueschner · Kelheim, DE
Guenther Ruhl · Regensburg, DE
Peter Stampka · Burglengenfeld, DE

Key dates

Filing date	May 31, 2017
Grant date	Apr 3, 2018
Priority date	—
Expiry date	May 31, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.