Semiconductor packaging and manufacturing method thereof
US9935044B2 · kind B2 · utility
1Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2016 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Apr 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.