Laser sintered interconnections between die
US9935079B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2016 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Dec 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a microelectronic packaged device and methods of making are provided, where the microelectronic packaged device includes a system package comprising a first die and a second die, wherein the first die and the second die are laterally positioned to one another, and the first die and the second die are laterally separated from one another by mold compound; and a conductive trace formed between a first conductive surface on an exposed surface of the first die and a second conductive surface on an exposed surface of the second die, wherein the conductive trace is laser sintered directly on the first conductive surface, on a portion of the exposed surface of the first die, on a portion of a top surface of the mold compound, on a portion of the exposed surface of the second die, and on the second conductive surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.