Patent · US Active

Integrated circuit assemblies with molding compound

US9936582B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Junfeng Zhao · Singapore, SG
Saeed S. Shojaie · Folsom, US
Cheng Yang · Shanghai, CN

Key dates

Filing date	Apr 30, 2014
Grant date	Apr 3, 2018
Priority date	—
Expiry date	Jan 28, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49131
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of integrated circuit (IC) assemblies and related techniques are disclosed herein. For example, in some embodiments, an IC assembly may include a first printed circuit board (PCB) having a first face and an opposing second face; a die electrically coupled to the first face of the first PCB; a second PCB having a first face and an opposing second face, wherein the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints; and a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB. Other embodiments may be disclosed and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.