Method for manufacturing element chip
US9941167B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2017 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Feb 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3065
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method includes a laser scribing step of forming an opening including an exposing portion, where the first layer is exposed, by irradiating the dividing region of the substrate with laser light from the first main surface side, forming a remaining region on which the second layer in the dividing region remains around the opening other than the exposing portion, and forming a first damaged region of a surface layer portion of the first layer including the exposing portion and a second damaged region of a surface layer portion of the first layer to be covered by the remaining region on the first layer of the dividing region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.