Thermal interface material on package
US9941184B2 · kind B2 · utility
3Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2017 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Oct 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.