Eric Salvas
14Patents
5h-index
18Co-inventors
59Inventor score
Filing activity: Jan 22, 2009 → Feb 28, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8202765B2 | Achieving mechanical and thermal stability in a multi-chip package | Electricity | 17 | Active |
| US8421217B2 | Achieving mechanical and thermal stability in a multi-chip package | Electricity | 15 | Active |
| US9257307B2 | Thermal interface material on package | Electricity | 6 | Active |
| US9257308B2 | Thermal interface material on package | Electricity | 6 | Active |
| US9252029B2 | Thermal interface material on package | Electricity | 6 | Active |
| US8614900B2 | Grounded lid for micro-electronic assemblies | Emerging Cross-Sectional Technologies | 3 | Active |
| US9941184B2 | Thermal interface material on package | Electricity | 3 | Active |
| US9576878B2 | Thermal interface material on package | Electricity | 0 | Active |
| US9646913B2 | Thermal interface material on package | Electricity | 0 | Active |
| US9252121B2 | Thermal interface material on package | Electricity | 0 | Active |
| US9881848B2 | Thermal interface material on package | Electricity | 0 | Active |
| US10896862B2 | Thermal interface material on package | Electricity | 0 | Active |
| US9761505B2 | Thermal interface material on package | Electricity | 0 | Active |
| US9042120B2 | Grounded lid for micro-electronic assemblies | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.