Unit and method for cooling, and apparatus and method for treating substrate
US9945570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2014 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | May 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate treating apparatus. The substrate treating apparatus includes an equipment front end module, a loadlock chamber, a transfer chamber, and a plurality of process chambers. The loadlock chamber includes a cooling unit for cooling a substrate treated in the process chambers, and the cooling unit includes a cooling chamber having an inner space, the cooling chamber having a gas inflow hole in one surface thereof, wherein support pins on which the substrate is placed are disposed around a circumference of the gas injection hole, a cooling gas injection part supplying a cooling gas toward the gas inflow hole, and a gas exhaust part exhausting the cooling gas supplied into the cooling chamber and fumes generated from the substrate to the outside of the cooling chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.