Patent · US Active

Integrated circuit package, and methods and tools for fabricating the same

US9947560B1 · kind B1 · utility

4Cited by

6References

7Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Mohsen H. Mardi · Saratoga, US
David Tan · Garching bei München, DE
Gamal Refai-Ahmed · Markham, CA

Key dates

Filing date	Nov 22, 2016
Grant date	Apr 17, 2018
Priority date	—
Expiry date	Nov 22, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/35121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) package, assembly tool and method for assembling an IC package are described herein. In a first example, an IC package is provided that includes a package substrate, at least a first integrated circuit (IC) die and a cover. The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections. The cover is bonded to the package substrate. The cover encloses the first IC die and is laterally offset from a peripheral edge of the package substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.