Resin composite electrolytic copper foil, copper clad laminate and printed wiring board
US9949371B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 19, 2016 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.