Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component
US9949380B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2016 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Jan 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0278
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of an electronic component including a circuit component provided with plural first electrodes in an end, and a substrate provided with plural second electrodes includes: pressing a part of a second surface of an inside of a second edge of the circuit component in the end to the substrate by a press attaching surface of the press attaching tool with an adhesive arranged between the circuit component and the substrate; making a part of the adhesive reach the second surface to cover at least a part of the second edge by the pressing; and curing the adhesive between the end and the substrate and the part of the adhesive covering the at least the part of the second edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.