Hybrid low metal loading flux
US9950393B2 · kind B2 · utility
0Cited by
9References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2011 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | May 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/046
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.