CMP porous pad with particles in a polymeric matrix
US9951054B2 · kind B2 · utility
14Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2010 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Jun 13, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07D471/04
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing pad comprising a polymeric matrix and 0.1-15 wt. % of metal oxide particles. The polymeric matrix has pores, the metal oxide particles are uniformly distributed throughout the pores, and the metal oxide particles have a specific surface area of about 25 m2/g to about 450 m2/g. The invention further provides a method of polishing a substrate with the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.