Semiconductor device and manufacturing method thereof
US9953894B2 · kind B2 · utility
0Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2017 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Mar 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including: a semiconductor element, a substrate having a first surface on which the semiconductor element is provided, and a second surface located opposite the first surface, a metal species provided on the second surface, and a plated metal portion provided at least in part on the second surface on the metal species. The semiconductor device further includes a first region where the plated metal portion is provided and a second region where the plated metal portion is not provided are alternately arranged at a peripheral portion of the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.