Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object
US9954160B2 · kind B2 · utility
3Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2014 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Sep 13, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to d1 and a minimum diameter of each of the through holes is set to d2, d1/d2 is preferably equal to or greater than 0.8 and equal to or less than 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.