Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
US9955567B2 · kind B2 · utility
1Cited by
37References
10Claims
0Family size
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Key dates
| Filing date | Jul 27, 2014 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | May 4, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.