Multi-layer printed circuit boards with dimensional stability
US9955569B2 · kind B2 · utility
0Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2016 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Nov 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.