Separation method, separation apparatus, and separation system
US9956755B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 16, 2012 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Jul 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1972
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.