Micromechanical pressure sensor device and corresponding manufacturing method

US9958348B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Johannes Classen · Reutlingen, DE
• Jochen Reinmuth · Reutlingen, DE
• Arnd Kaelberer · Neckargemünd, DE

Key dates

• Filing date: Nov 17, 2014
• Grant date: May 1, 2018
• Expiry date: Nov 17, 2034

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2207/012
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device includes an ASIC wafer having a front side and a rear side, and a rewiring system, formed on the front side of the ASIC wafer, which includes a plurality of stacked strip conductor levels and insulation layers. The pressure sensor device also includes a MEMS wafer having a front side and a rear side, a first micromechanical functional layer which is formed above the front side of the MEMS wafer, and a second micromechanical functional layer which is formed above the first micromechanical functional layer.