Polishing apparatus and semiconductor manufacturing method
US9960071B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Jan 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polishing apparatus according to an embodiment includes a first polishing part, a second polishing part, and an annular part. The second polishing part includes a mounting surface for a semiconductor substrate, and rubs the semiconductor substrate mounted on the mounting surface while pressing the semiconductor substrate against the first polishing part. The annular part includes a support part provided in the second polishing part, and a plurality of convex portions that project from the support part toward the first polishing part, are arranged in a circumferential direction around the mounting surface while being supported by the support part, and are movable in a radial direction of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.