Patent · US Active

Passive within via

US9960079B2 · kind B2 · utility

1Cited by

10References

11Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Todd Myers · Gilbert, US
Nicholas R. Watts · Phoenix, US
Eric Palmer · Tempe, US
Jui Min Lim · Chandler, US

Key dates

Filing date	May 17, 2013
Grant date	May 1, 2018
Priority date	—
Expiry date	May 17, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49165
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.