Controlled solder height packages and assembly processes
US9960105B2 · kind B2 · utility
6Cited by
15References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2012 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Sep 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.