Semiconductor device package and method for forming the same
US9960137B1 · kind B1 · utility
6Cited by
0References
17Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 1, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Nov 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.