Semiconductor device and manufacturing method thereof
US9960328B2 · kind B2 · utility
15Cited by
235References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Sep 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.