Patent · US Active

Method for cutting a carrier for electrical components

US9961777B2 · kind B2 · utility

1Cited by

10References

14Claims

0Family size

Assignee

AMS AG · AT

Inventor

Bernhard Stering · Stainz, AT

Key dates

Filing date	Apr 17, 2012
Grant date	May 1, 2018
Priority date	—
Expiry date	Aug 3, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49124
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A trench (20) is introduced into a carrier (10) for electrical components (30) on a first surface (O10a) of the carrier into the material of the carrier (10). The carrier (10) is cut through by a cut (60) being introduced into the material of the carrier from a second surface (O10b) of the carrier (10), said second surface being situated opposite the first surface. The cut is implemented in such a way that the cut (60) runs through the trench (20) on the first surface (O10a) of the carrier. By providing a trench (20) in the material layers of the carrier (10) which are near the surface, it is possible to prevent material from breaking out of the carrier during the singulation of devices (1, 2).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.