Method of separating a carrier-workpiece bonded stack
US9962919B2 · kind B2 · utility
3Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2015 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Jul 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1967
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a method of separating a bonded stack utilizing the force generated by a gas jet. The stack includes a carrier and a thinned workpiece such as device wafer that are bonded together through one or more layers therebetween. The gas jet can separate two adjacent layers having peeling strength therebetween in the range of from 0.01 to 50.0 g/cm. The invention can simplify the procedure and provide high throughput in separating thinned wafer from its carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.