Method of determining dose and focus, inspection apparatus, patterning device, substrate and device manufacturing method
US9964853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2013 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Nov 22, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70683
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of determining exposure dose of a lithographic apparatus used in a lithographic process on a substrate. Using the lithographic process to produce a first structure on the substrate, the first structure having a dose-sensitive feature which has a form that depends on exposure dose of the lithographic apparatus on the substrate. Using the lithographic process to produce a second structure on the substrate, the second structure having a dose-sensitive feature which has a form that depends on the exposure dose of the lithographic apparatus but which has a different sensitivity to the exposure dose than the first structure. Detecting scattered radiation while illuminating the first and second structures with radiation to obtain first and second scatterometer signals. Using the first and second scatterometer signals to determine an exposure dose value used to produce at least one of the first and second structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.