System and method for performing directed self-assembly in a 3-D virtual fabrication environment
US9965577B2 · kind B2 · utility
9Cited by
3References
24Claims
0Family size
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Key dates
| Filing date | Apr 4, 2016 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Apr 4, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The modeling of a DSA step within a virtual fabrication process sequence for a semiconductor device structure is discussed. A 3D model is created by the virtual fabrication that represents and depicts the possible variation that can result from applying the DSA step as part of the larger fabrication sequence for the semiconductor device structure of interest. Embodiments capture the relevant behavior caused by polymer segregation into separate domains thereby allowing the modeling of the DSA step to take place with a speed appropriate for a virtual fabrication flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.