Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US9967976B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 21, 2015 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Dec 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.