Electronic-component mounting apparatus
US9968020B2 · kind B2 · utility
1Cited by
6References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 23, 2015 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Apr 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.