Spin chuck with in situ cleaning capability
US9968970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2015 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Feb 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method and apparatus for processing wafer-shaped articles, a spin chuck is positioned inside a process chamber. The spin chuck is configured to hold a wafer-shaped article at a predetermined process position. A cover covers the spin chuck and is affixed to or integral with the spin chuck for rotation therewith. The cover has a central opening. A stationary nozzle assembly extends into the process chamber such that a discharge end of the stationary nozzle assembly passes through the central opening of the cover. The nozzle assembly comprises a rinse nozzle configured to direct rinse liquid radially outwardly of the nozzle assembly onto a downwardly-facing surface of the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.