Polishing layer of polishing pad and method of forming the same and polishing method
US9969049B2 · kind B2 · utility
1Cited by
5References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2016 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Nov 24, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.