Method for forming micro-electro-mechanical system (MEMS) beam structure
US9969613B2 · kind B2 · utility
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4References
19Claims
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Key dates
| Filing date | Apr 12, 2013 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | May 6, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0714
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.