Induction sealing of inorganic substrates
US9969648B2 · kind B2 · utility
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5References
16Claims
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Key dates
| Filing date | Sep 12, 2012 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Sep 16, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of sealing at least two inorganic substrates together using an induction energy source comprising applying to at least one of the substrates a paste composition including a glass frit, and an induction coupling additive, bringing at least a second substrate into contact with the paste composition, and subjecting the substrates and paste to induction heating, thereby forming a hermetic seal between the two inorganic substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.