Patent · US Active

Warpage balancing in thin packages

US9972582B2 · kind B2 · utility

1Cited by

1References

20Claims

0Family size

Assignee

Invensas LLC · US

Inventors

Belgacem Haba · Cupertino, US
Sangil Lee · Santa Clara, US
Craig Mitchell · San Jose, US
Gabriel Z. Guevara · Gilroy, US
Javier A. Delacruz · San Jose, US

Key dates

Filing date	Aug 7, 2017
Grant date	May 15, 2018
Priority date	—
Expiry date	Aug 7, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.